Solder Reflow and Packaging Furnace

High-temperature controlled atmosphere applications

Product Line

1500 Series
Fast Response Conveyor Furnace

2500 Series
Controlled Atmosphere Conveyor Furnace

3500 Series
Solder Reflow and Packaging Furnace

4500 Series
Curing and Drying Oven

5500 Series
APCVD System

7500 Series
Infrared Lamp Furnace

8500 Series
Elevator Batch Oven

9500 Series
Advanced Innovation

The SierraThermal 3500 Series is designed for controlled atmosphere applications of up to 600°C. Air, nitrogen, hydrogen, and combinations of these gases are possible and maintained at extreme levels of purity in the muffle-contained environment. The innovative chamber design facilitates precise atmosphere and temperature uniformity while enabling dynamic thermal process profiles.

High-temperature controlled atmosphere applications

The 3500 Series Reflow and Packaging Furnace from SierraThermal is designed for precision processing in manufacturing operations requiring performance of the highest quality and consistency. These ovens are rated at 600 °C for maximum process flexibility, more than twice as high as the average solder reflow oven.  Technologically advanced heating elements and control systems work together to create exceptionally stable temperature uniformity and repeatability throughout the process chamber. Graduated cooling sections can be custom designed to accommodate the most dynamic thermal processes.

SierraThermal’s innovative and product specific atmosphere distribution and management systems optimize the process results. A controlled atmosphere capability of 1-3 ppm above source gas purity is guaranteed. Through extraction of burn-off effluents across the entire chamber width keeps part yields high. SierraThermal muffles are designed for maximum rigidity and durability under extreme operating conditions insuring years of trouble-free manufacturing.

The Furnace Monitoring System (FMS) is the culmination of decades of thermal processing expertise and incorporates the latest technology in digital controls and monitoring systems. The result is a powerful yet intuitive interface with comprehensive data logging, process control, and process characterization features.

Applications:

Lead and lead-free solder reflow

BGA reflow

Wafer Bumping

Assembly

Package sealing



Benefits:

Zone isolation and rapid quenching technologies allow precision definition of reflow phase peaks

Three tiers of graded, power saving insulation reduces energy bills

Reliable conveyor belt and drive systems accommodate a wide range of loading configurations

Many optional features available

Customizable to meet specific processing requirements

World class HMI with built in profiling, data and event logging, and touchscreen interface

Technical Data:

Maximum temperature rating:
600° C

Atmosphere Control:
Nitrogen, Hydrogen, Air, Oxygen, or combinations of these

Custom atmospheric profiles including distinct in-line process chambers

Heating:
Ceramic fiber block with embedded resistive wire heating elements

Cooling:
Free and forced convection/conduction
Both air and water as standard

Conveyor belt:
Widths: 6 – 36 inches (150 – 914 mm)
Clearance above: 1 – 8 inches (25 – 200 mm)

Ready to learn more?

Contact our sales team: sales@s-thermal.com